SENIOR ELECTIVE /
GRADUATE COURSES
NEW COURSE ANNOUNCEMENT FOR
SUMMER 2013
1- ELEN-4304-32 / ENGR-5301-32 “VLSI Design and
CAD tools”
This introductory course will address
following topics:
·
CMOS Processing Steps, Fabrication Process Flow,
·
N-Well CMOS Technology, Twin Tub process, SOI
·
CMOS layout design using Microwind layout and verification
software
·
Layout Simulation and parasitic extraction
·
VLSI interconnect modeling and optimization techniques
·
Crosstalk Noise calculation and prediction techniques
·
Interconnect Delay Calculation, Miller factor
formulation
·
Use of the Synopsys HSpice to simulate RC/RLC
interconnects
·
Alternative interconnect
technologies
·
Optical interconnect (VCSEL, MQW) and RF Interconnect technologies
·
Silicon LED based optical interconnect links
·
Hardware Description language (HDL), VHDL Design and
modeling
·
VHDL simulation and verification
·
Synopsys HSpice
simulation
COURSE ANNOUNCEMENT FOR
SUMMER 2013
The goal is to introduce low power design
techniques that are radiation tolerant and energy efficient at the same time.
·
CMOS low power design
·
Low Power Design Methodologies: Leakage power Control
·
Multithreshold CMOS, VTCMOS, dynamic voltage scaling
·
Body bias
techniques, input vector control etc.
·
Space Radiation Environment
·
Radiation
Effect Modeling
·
CMOS
Reliability, Radiation Effects on Commercial
Electronics
·
Single Event Soft Error Mechanisms , hard
errors
·
Soft Error Mitigation
·
The effect of
power optimizations on radiation tolerance
·
Low power and
radiation tolerant designs.
·
HSPICE
Simulations to model radiation effects
·
COURSE ANNOUNCEMENT FOR SPRING 2013
3-Topics in VLSI Design and
Testing
·
VLSI and
Scaling Trends, Basics
·
VLSI
Test Principles, ATE, Defects,
·
Stuck at Faults, Transistor stuck on/open faults
·
Fault
collapsing: Fault equivalence and dominance
·
Controllability, Observability, SCOAP
·
Testability Design Techniques : Scan Design, BIST, Pseudo-random
Test
·
Pattern
Generation (LSSD) IDDQ/IDDT Testing
·
Advanced Diagnostic
Techniques for VLSI
·
Electron Beam Testing, Electro-optic probing
·
Technique based on optical emission from chip: Hot carrier light
emission, PICA, Plasma-Optical Probe
·
Scanning Force Microscope, Contactless current measurement
·
Introduction
to Low Power Design Techniques
·
Class
Discussion on various topics (i.e.: testing challenges with leakage, effect of
radiation etc.)
·
Crosstalk
defect testing
OTHER COURSES
4-CMOS
DIGITAL INTEGRATED CIRCUITS ANALYSIS AND DESIGN (Offered during Fall Semesters)
Text: Analysis
and Design of Digital Integrated Circuits, Hodges and Jackson
·
VLSI and Scaling Trends
·
Basic MOS Transistor
Theory
·
MOSFET Capacitances
·
MOS Inverter Circuits,
Static and Dynamic Characteristics
·
NMOS Inverter with
Enhancement Load,NMOS Inverter with Depletion Load
·
NMOS Logic
·
CMOS (Complementary) MOS
Inverter, CMOS Transmission Gate
·
Construction of CMOS
Gates, Complex Functions
·
CMOS Inverter VTC
Characteristics
·
Dynamic Power
Dissipation, Inverter Switching Threshold
·
Inverter Delay
Calculation, Use of Cascaded Buffers for minimum Delay
·
HSPICE Introduction,
SPICE Modeling of MOS Devices
·
Interconnect Design, IC
circuit scaling vs. interconnect scaling
·
Interconnection
parameters: resistance, capacitance, 3-D capacitance, inductance
·
Skin effect, Inductance
Interconnect Models
·
Delay modeling, Elmore
Delay Model for RC trees
·
CMOS Inverter capacitances
·
Buffer Insertion Problem
(Repeaters) for long interconnects.
·
Power and Ground
Distribution
·
Power Grid Integrity,
Electro-migration, MTTF
·
Power Routing, Decoupling
Capacitances
·
Crosstalk analysis of RC
lines
·
Low Power Design Issues:
·
Clocking and Timing
Issues
·
Clock Uncertainties,
Clock Distribution
·
Pass Transistor
(Transmission Gate) Logic Design
·
Static Power Dissipation-
Leakage Power in CMOS
·
Introduction to CMOS VLSI
Testing
Course Prerequisite(s)
ELEN 3321 and 3322 Electronics I and II
ELEN 3431 Logical Design of Switching Systems
References:
·
Analysis
and Design of Digital Integrated Circuits, Hodges and Jackson
·
Digital
Integrated Circuits, Rabaey, Prentice Hall,2003
·
Circuits,
Interconnections, and Packaging from VLSI, H.B.Bakoglu,
Addison and Wesley, 1990.
·
CMOS
Digital IC’s by Kang and Leblebici, McGraw Hill,
2003.
UNDERGRADUATE COURSES
1- ELEN 3421- ELECTRONICS I
(FALL SEMESTERS)
Text: Microelectronics: Circuit Analysis and
Design, 4th Edition, by D. A. Neamen..
References:
“Schematic Capture with
Electronics Workbench Multisim”, Herniter,
PrenticeHall
“Microelectronic Circuit Design”,
Jaeger/ Blalock
“Microelectronic
Circuits”, Sedra/Smith 4th edition
Course Topics:
Semiconductor Materials
Diode Circuits
Bipolar Junction Transistor (BJT) Circuits
Basic BJT Amplifiers
Field Effect Transistors: MOSFETs, JFETs
FET Amplifiers
Op-amp circuits.
2- ELEN 3322- ELECTRONICS II
(SPRING SEMESTERS)
Text: Microelectronics: Circuit Analysis and
Design, 4th Edition, by D. A. Neamen.
References:
“Schematic Capture with Electronics Workbench Multisim”, Herniter, PrenticeHall
“Microelectronic
Circuits”, Sedra/Smith 4th edition
“Microelectronic
Circuit Design”, Jaeger/ Blalock
Course
Topics:
Frequency Response
Power Amplifiers
Integrated Circuit Biasing
Differential And Multistage Amplifiers
Feedback And Stability
Nonideal Effects In Analog Ic’s
Applications Of Integrated Circuits
Text: Engineering Analysis by Hayt&Kemmerly, McGraw-Hill, 2nd Edition
DC Resistive Circuits-
Kirchoff’s Laws, Nodal, Mesh Analysis,
Superposition, Thevenin, Max. Power Transfer
Transient Circuits- RC, RL, RLC Circuits
AC Circuits- Sinusoids, Phasors, Nodal, Mesh
Analysis, Superposition
4- ELEN 2107 CIRCUITS LAB
(During Spring Semesters)
(Now Part of Circuits I)
5- ELEN 3108 ELECTRONICS
LAB (During Fall)
(Now Part of
Electronics I)
6- ELEN 2310
Fundamentals of Electrical Engineering online course for Winter Mini Session
(NEW)